MFG Tray Fibrestat products are molded from high-strength, glass-reinforced composites and are specifically formulated to dissipate electrostatic discharge. The fiber component provides strength and dimensional stability, while the thermoset resin provides specific chemical, electrical, and thermal properties.

The high conductivity/low electrical resistance of MFG Tray’s composite material are permanent properties that ensure the safe transfer of electrostatic discharge away from sensitive microprocessors, assemblies, loaded circuit boards, and other electronic components for the life of the tray or container.